Place of Origin: Guangdong, China
Material Introduction:
This product is made from high-purity silicon carbide ceramic, designed for wafer adsorption, vacuum holding, and precision positioning in semiconductor handling equipment. Compared with general ceramic suction parts, this SiC vacuum chuck focuses more on surface flatness, dimensional stability, vacuum sealing performance, and clean process compatibility.
Functional Features:
The silicon carbide ceramic vacuum chuck provides stable wafer holding, good surface flatness, reliable dimensional accuracy, and strong resistance to heat, wear, and chemical corrosion. It is suitable for repeated wafer transfer and positioning processes where low contamination, stable adsorption, and accurate alignment are important.
Application Industries:
Mainly used in semiconductor ceramic parts, wafer transfer systems, vacuum chuck platforms, cleanroom automation equipment, LED manufacturing, solar cell production, microelectronics assembly, and other precision wafer handling applications.
Delivery Time:
Typical lead time depends on wafer size, chuck structure, flatness requirement, surface finish, vacuum groove or hole design, assembly method, and order quantity. Custom ceramic vacuum chucks can be evaluated according to drawings, samples, or equipment requirements before production.
The Silicon Carbide Ceramic Vacuum Chuck is a precision wafer holding component used in semiconductor wafer adsorption, vacuum clamping, and positioning systems. Made from sintered SiC ceramic, it is designed to keep the wafer stable during loading, transfer, inspection, and processing. It helps reduce wafer deformation, improve positioning accuracy, and lower contamination risk in cleanroom equipment.
This vacuum chuck is made from high-purity silicon carbide ceramic, such as SSiC or RBSiC, depending on the application. SiC is used because it offers high stiffness, good thermal conductivity, strong wear resistance, and stable dimensions under demanding process conditions.
Unlike a general porous ceramic sucker, this product is focused on wafer contact accuracy. Key design points include surface flatness, burl or pin height uniformity, parallelism, vacuum groove layout, hole design, and mounting accuracy. The structure can be customized according to wafer size, equipment interface, and process requirements.
In many semiconductor ceramic parts applications, the chuck must hold the wafer securely without causing backside marks, local stress, particle generation, or alignment drift. A well-designed SiC ceramic vacuum chuck helps support stable wafer handling during repeated loading and unloading.
The following values are reference indicators for SiC ceramic vacuum chuck applications. Final specifications should be confirmed according to ceramic grade, product size, drawing tolerance, inspection method, and actual equipment requirements.
| Parameter | Technical Indicator | Functional Significance |
|---|---|---|
| Material Composition | Sintered SiC Ceramic, such as SSiC or RBSiC | High-purity ceramic material helps reduce wafer contamination and provides high rigidity. |
| Surface Flatness | ≤ 1 μm, total area | Helps keep the wafer surface within the required focal plane during precision processing. |
| Burl / Pin Height Uniformity | ±0.1 μm | Helps reduce local chucking stress and avoid wafer deformation during adsorption. |
| Parallelism | ≤ 2 μm | Maintains alignment between the wafer and the optical, inspection, or etching system. |
| Vickers Hardness | 20–25 GPa | Provides wear resistance during repeated wafer loading and unloading cycles. |
| Elastic Modulus | 410–450 GPa | High rigidity helps reduce vibration, bending, and mechanical drift during operation. |
| Thermal Conductivity | 120–200 W/(m·K) | Helps stabilize wafer temperature during high-energy or thermal process conditions. |
| Surface Roughness | Ra ≤ 0.1 μm, on burls or contact surface | Helps reduce particle generation and backside damage to the wafer. |
| Customization | Diameter, thickness, grooves, holes, burls, pins, and mounting design | Allows the chuck to match wafer size, vacuum layout, and equipment assembly requirements. |
| Material | Main Strengths | Typical Use |
|---|---|---|
| Sintered Silicon Carbide Ceramic | High stiffness, good thermal conductivity, high hardness, low wear, and strong chemical resistance | Wafer vacuum chucks, adsorption platforms, semiconductor handling parts, and precision process fixtures |
| Alumina Ceramic | Good insulation, stable performance, and cost-effective manufacturing | General ceramic insulators, support parts, spacers, and less demanding ceramic fixtures |
| Aluminum Nitride Ceramic | High thermal conductivity with electrical insulation | Thermal management parts, electronic substrates, and heat dissipation components |
| Metal Vacuum Chuck | Easy machining and good toughness | General vacuum holding fixtures, but less suitable where low contamination and thermal stability are critical |
It is a precision ceramic wafer holding part used to adsorb, support, and position wafers in semiconductor handling or processing equipment.
It is mainly used for wafer adsorption, vacuum holding, wafer transfer, alignment, inspection, lithography support, etching, cleaning, and other semiconductor process applications.
A porous ceramic sucker focuses more on pore structure and air permeability. This SiC ceramic vacuum chuck focuses more on wafer flatness, burl height uniformity, parallelism, vacuum sealing, and positioning stability.
SiC ceramic provides high stiffness, good thermal conductivity, wear resistance, chemical stability, and low contamination risk, making it suitable for demanding wafer handling environments.
Yes. Surface flatness can be customized according to wafer size, process accuracy, equipment assembly, and drawing requirements.
Yes. Burl, pin, groove, hole, and vacuum channel designs can be customized according to the wafer support method and vacuum layout.
Useful information includes wafer size, chuck diameter, thickness, vacuum groove or hole design, flatness requirement, surface roughness, parallelism, mounting method, quantity, and drawings.
Yes. SiC ceramic vacuum chucks are suitable for cleanroom equipment where low particle generation, low contamination, stable adsorption, and accurate alignment are required.
Yes. Silicon carbide ceramic has good thermal stability and thermal conductivity, so it can be considered for high-temperature or thermal cycling process environments.
Yes. CERAMPRO can support drawing evaluation, material selection, precision machining, inspection, and custom production for precision ceramic components used in semiconductor and other demanding industrial applications.
