Ceramic Substrates Made to Order

Ceramic substrates are fundamental components in modern electronic systems. CERAMPRO provides specialized custom solutions utilizing a range of advanced ceramic materials, including alumina, aluminum nitride, zirconia, silicon nitride, and silicon carbide.

We offer a comprehensive portfolio of mainstream ceramic substrates, delivering a one-stop service. Furthermore, with integrated capabilities in thin-film circuit fabrication, precision laser processing, and substrate metallization, we manufacture high-quality thin-film ceramic substrates and ceramic-based PCBs. Contact CERAMPRO to discover the optimal solution tailored to your needs.

CERAMPRO | Customizable Ceramic Substrate Materials

1. Engineering Drawing Analysis (DFM) :Optimize product structure to enhance manufacturability and cost-effectiveness.
2. Material Selection Structural Consul: tationProvide expert recommendations on materials and design based on your specific application environment (e.g., temperature, wear, and corrosion requirements).
3. Rapid Prototyping Validation Testing:Functional prototypes are typically delivered within7-15 working days , accompanied by performance test reports.
4. Flexible Production Scale: Full production capability from small-batch pilot runs of20 piecesto large-scale supply ofmillions of units .
5 .End-to-End Quality Inspection: Implement full-process quality control from incoming materials to final shipment, with100% inspectionof all critical dimensions.
6 .Global Delivery Support: Provide shock-proof secure packaging, factory test reports, and support fast logistics to major global markets.

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Standard Size of Substrate

Standard Size of Substrate

Substrate Thickness

Substrate Thickness

Technical Capabilities

Technical Capabilities

CERAMPRO | Laser & Metallized Substrates

CERAMPRO Advantage

•10+ Years of Focus on Precision Ceramics
Extensive expertise in materials including zirconia, alumina, silicon nitride, and aluminum nitride.
•High-Precision Machining Capability
Dimensional tolerance: ±0.002–0.005 mm | Surface roughness: Ra 0.1–0.4 μm
•Complete In-House Manufacturing System
Forming, CNC machining, grinding, polishing, metallization, plating, and laser processing—all completed internally.
•OEM/ODM Engineering Support
Provides drawing evaluation, Design for Manufacturing (DFM) optimization, and structural reinforcement recommendations.
• Quality and Reliability
Full-process IQC/IPQC/OQC inspection, with 100% verification of critical dimensions.
•Global Service
Serving clients in 20+ countries, with support for English-language engineering communication and rapid delivery.

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CERAMPRO | Your Expert in Thin-Film Circuits & Ceramic Substrates

CERAMPRO specializes in thin-film circuit processing, delivering advanced ceramic-based circuit solutions to global customers. Our automated thin-film circuit production line offers one-stop solutions for thin-film hybrid integrated circuits, encompassing material research, structural design, precision manufacturing, and system integration.

Our thin-film hybrid integrated circuits are widely used in various high-end applications, including 5G communication modules, satellite navigation antennas, microwave/millimeter-wave filters, high-performance attenuators, integrated sensors, RF front-end modules, LiDAR packaging, electric vehicle battery management systems, aerospace electronics, and data conversion modules.

If you require alumina/aluminum nitride ceramic substrates, Direct Bonded Copper (DBC) substrates, multilayer ceramic circuits, or metallized ceramic substrates, contact CERAMPRO immediately! We will provide you with professional customized services—precision in every layer, carrying the future.

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Shipping & Handling of Ceramics

At CERAMPRO, we manufacture high-performance industrial ceramics, includingAlumina, Zirconia, Beryllium Oxide, Aluminium Nitride, Silicon Nitride, Boron Nitride, Silicon Carbide, and Boron Carbide . These materials feature extreme hardness, wear resistance, and precise dimensions. While some materials are inherently more brittle, our professional shipping solutions ensure safe delivery.

Packaging Details:
● Multi-layer cushioning:Each product is first wrapped with anti-static film, then surrounded by high-density foam, EPE pearl cotton, or custom inserts to prevent scratches and minor impacts.
● Secure support structure:Fragile or precision ceramic parts are fixed using custom pallets, internal supports, or partitions to prevent shifting or collisions during transport.
● Sturdy outer carton:Outer packaging consists of reinforced corrugated boxes or wooden crates, providing pressure resistance, moisture protection, and shock absorption suitable for long-distance international shipping.
● Professional labeling:Each package is marked with “Fragile” and “This Side Up” signs to ensure careful handling throughout the logistics chain.

Shipping Assurance:
● Partnering with reliable international logistics companies for fully traceable shipments and timely delivery.
● Additional insurance is available for high-value or bulk orders, providing extra peace of mind.
Our professional packaging and shipping solutions minimize transport risks, ensuring every high-performance industrial ceramic product reaches our customers safely and intact.

What ceramic substrate materials does CERAMPRO offer?

CERAMPRO provides a range of high-performance ceramic substrates, with common options including Al2O3 (aluminum oxide), AlN (aluminum nitride), and Si3N4 (silicon nitride). Custom ceramic material combinations and specifications can be arranged based on customer requirements.

What are the differences between Al2O3, AlN, and Si3N4 substrates?

  • Al2O3 (aluminum oxide): Very hard with moderate thermal conductivity, cost-effective, excellent electrical insulation, and stable CTE; widely used, but thermal conductivity is comparatively lower.
  • AlN (aluminum nitride): Extremely high thermal conductivity, CTE close to silicon, excellent for high-power device cooling; good mechanical strength but higher cost.
  • Si3N4 (silicon nitride): High strength, good thermal shock resistance, stable dielectric properties; suited for high-temperature and high-stress environments, with mid-range cost.

What applications are ceramic substrates used for?

Ceramic substrates are widely used in high-power electronics, RF/microwave devices, LED packaging, sensor packaging, power modules, automotive electronics, and optoelectronic couplings, especially where high thermal conductivity, excellent dielectric properties, and mechanical robustness are required.

What metal bonding technologies do we support?

CERAMPRO supports multiple metal bonding technologies, including metal brazing/bonding, metallization for solderability, micro-adhesive bonding/wet-chemistry bonding, and silver-copper-aluminum alloy bonding. Specific solutions are customized based on material, dimensions, operating temperature, and thermal management needs.

Customizable

We have a wide range of technologies such as material technology, process technology, design technology, measurement/evaluation technology, and integrated processes from materials to products in-house, so we can respond to various customizations. Please feel free to contact us first.
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