Custom ceramic trays are manufactured from advanced ceramic materials such as alumina ceramic, aluminum nitride ceramic, and silicon carbide ceramic. The material can be selected according to working temperature, thermal conductivity, corrosion environment, cleanliness requirements, load capacity, and dimensional stability.
Ceramic trays provide excellent high-temperature resistance, chemical corrosion resistance, electrical insulation, thermal stability, and low contamination risk. They are suitable for repeated heating cycles, clean processing environments, and applications where metal trays may deform, oxidize, or contaminate the product.
Custom options include different shapes, sizes, thicknesses, holes, grooves, slots, surface finishes, flatness control, and precision-machined structures. For projects with tighter tolerance or special geometry requirements, related support is available through precision ceramic components manufacturing.
Custom ceramic trays are widely used in semiconductor wafer processing, LED epitaxial growth, photovoltaic cell manufacturing, electronic component sintering, powder metallurgy, laboratory furnaces, high-temperature heat treatment, chemical processing, and industrial furnace fixtures.
Delivery time depends on the selected ceramic material, tray size, structural complexity, tolerance requirements, surface finish, inspection standards, and order quantity. Standard tray designs can usually be arranged more efficiently, while fully customized trays with special holes, grooves, flatness control, or strict inspection requirements may require additional production and quality control time.
Final lead time will be confirmed after drawing review, material selection, technical evaluation, and production schedule confirmation.
Ceramic trays are support and handling components made from alumina, aluminum nitride, or silicon carbide ceramics. They are used in high-temperature furnaces, semiconductor processing, LED production, photovoltaic manufacturing, electronic component sintering, and laboratory applications. Compared with metal trays, ceramic trays offer better resistance to heat, corrosion, oxidation, and process contamination.
Ceramic trays can be produced from different advanced ceramic materials depending on the working temperature, load, atmosphere, cleanliness requirement, and contact material. Alumina ceramic is widely used for furnace trays, laboratory trays, electronic component sintering, powder sintering, and general high-temperature applications because it provides good strength, electrical insulation, wear resistance, and chemical stability.
Aluminum nitride ceramic is suitable for applications that require both thermal conductivity and electrical insulation. Silicon carbide ceramic is often selected for more demanding high-temperature, thermal shock, or clean processing environments. The final material should be chosen according to the actual process temperature, tray structure, contact material, and operating conditions.
Ceramic trays are used when parts, powders, wafers, or samples need stable support during heating, firing, sintering, or chemical processing. They help reduce deformation, oxidation, and contamination in process environments where metal trays may not perform well.
The following data is for alumina ceramic tray materials and is provided as a general reference. Actual values may vary depending on material grade, tray size, thickness, forming method, and final machining requirements.
| Property | Unit | Al₂O₃ ≥ 99.7% | Al₂O₃ ≥ 99.5% |
|---|---|---|---|
| Purity | % | 99.7 | 99.5 |
| Density | g/cm³ | 3.92 | 3.90 |
| Bending Strength | MPa | 375 | 370 |
| Compressive Strength | MPa | 2450 | 2300 |
| Elastic Modulus | GPa | 380 | 370 |
| Fracture Toughness | MPa·m1/2 | 4.5 | 4.3 |
| Hardness | HRA | 91 | 91 |
| Vickers Hardness | HV1 | 1600 | 1550 |
| Thermal Expansion Coefficient | 10⁻⁶ K⁻¹ | 7.8 | 7.8 |
| Thermal Conductivity | W/m·K | 32 | 32 |
| Thermal Shock Stability | ΔT °C | 220 | 220 |
| Maximum Operating Temperature | °C | 1750 | 1750 |
| Volume Resistivity at 20°C | Ω·cm | 1015 | 1015 |
| Dielectric Strength | kV/mm | 22 | 20 |
| Dielectric Constant at Room Temperature | / | 10 | 11 |
| Dielectric Loss Factor | tan δ | 1 × 10⁻³ | 1 × 10⁻³ |
| Material | Main Features | Typical Use |
|---|---|---|
| Alumina Ceramic | High hardness, good electrical insulation, chemical stability, wear resistance, and high-temperature resistance | Laboratory trays, furnace trays, electronic component sintering, powder sintering, and industrial heat treatment |
| Aluminum Nitride Ceramic | High thermal conductivity with electrical insulation | Electronic thermal processing, semiconductor-related fixtures, and applications requiring heat transfer and insulation |
| Silicon Carbide Ceramic | Excellent thermal shock resistance, high thermal conductivity, and strong high-temperature performance | Semiconductor processing, wafer support, CVD/PVD environments, and high-temperature clean process trays |
Ceramic trays are used to support parts, powders, wafers, or samples during high-temperature processing, sintering, heat treatment, semiconductor processing, laboratory testing, and chemical handling.
Common materials include alumina ceramic, aluminum nitride ceramic, and silicon carbide ceramic. The right material depends on working temperature, corrosion environment, thermal conductivity, insulation needs, and cleanliness requirements.
Alumina ceramic trays are suitable for general high-temperature use, laboratory furnaces, electronic component sintering, powder sintering, and industrial heat treatment. They are often selected when strength, insulation, chemical stability, and cost efficiency are important.
Aluminum nitride ceramic trays are suitable for applications that require both thermal conductivity and electrical insulation, especially in electronic, semiconductor-related, and thermal management processes.
Silicon carbide ceramic trays are suitable for high-temperature, thermal shock, and clean processing environments. They are often used in semiconductor, CVD/PVD, and other demanding thermal processes.
Yes. In high-temperature, corrosive, clean, or electrically insulating environments, ceramic trays can provide better oxidation resistance, dimensional stability, corrosion resistance, and lower contamination risk than many metal trays.
Yes. Holes, grooves, slots, raised edges, positioning steps, and other functional structures can be produced according to drawings or application requirements.
Please provide the material, drawing or sample, size, thickness, quantity, working temperature, application environment, tolerance requirements, surface finish, and any special holes, grooves, or positioning features.
Lead time depends on material selection, tray size, structural complexity, tolerance requirements, surface finish, inspection standards, and order quantity. The final schedule will be confirmed after technical review.
Yes. Key dimensions, appearance, flatness, hole position, surface quality, and other critical features can be checked before shipment according to project requirements.
